| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a film adhesive which can correspond to a flip chip connection method, and to provide a method of manufacturing a semiconductor device using the same. <P>SOLUTION: The film adhesive includes: (a) a solid resin having at most 10,000 of a weight-average molecular weight and being a solid at the ordinary temperature (25°C); (b) an insulating spherical inorganic filler; (c) an epoxy resin; and (d) a curing agent containing a microcapsule type curing agent. The blending amount of (a) is 5-50 pts.wt, the blending amount of (b) is 25-80 pts.wt, and the blending amount of (c) is 10-70 pts.wt based on 100 pts.wt of the total amount of the (a) component, (b) component and (c) component; and the blending amount of (d) is 0.1-40 pts.wt based on 100 pts.wt of (c). The melt viscosity at 150°C is higher than 200 Pa s. The flow amount which is the ratio of the initial area of the film adhesive inserted between parallel plates at the time of heating and pressurizing at 100°C to the area after the heating and pressurizing is at least 1.5. The mean coefficient of linear expansion at 20-300°C of a cured product is at most 200×10<SP POS="POST">-6</SP>/°C. <P>COPYRIGHT: (C)2012,JPO&INPIT |
