发明名称 FILM SURFACE TREATMENT METHOD AND DEVICE
摘要 <p>To improve the adhesive durability of a resin film, oxygen- and nitrogen-containing electrical-discharge gas for pretreatment is fed between electrodes (12, 13), formed into a plasma under near-atmospheric pressure, and brought into contact with a film (9) to be treated (plasma pretreatment step). At this time, the supply of energy is adjusted. The supply of energy, which is based on the power supplied from a power source (3), is preferably 0.5-7.5 W·sec/cm2 per unit area of the film (9) to be treated. Subsequently, reaction gas containing a polymerizable monomer is brought into contact with the film to be treated after the plasma pretreatment step (reaction gas blowing step). Electrical discharge gas for polymerizing treatment is then formed into a plasma at near-atmospheric pressure and is brought into contact with the film to be treated (plasma polymerization treatment step).</p>
申请公布号 WO2012043385(A1) 申请公布日期 2012.04.05
申请号 WO2011JP71640 申请日期 2011.09.22
申请人 SEKISUI CHEMICAL CO., LTD.;NAKANO YOSHINORI;NOGAMI MITSUHIDE;MATSUZAKI JUNICHI 发明人 NAKANO YOSHINORI;NOGAMI MITSUHIDE;MATSUZAKI JUNICHI
分类号 C08J7/04;C08F2/00;G02B1/12;G02B5/30 主分类号 C08J7/04
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