SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME

摘要

PURPOSE: A semiconductor device and a manufacturing method thereof are provided to connect an insulating substrate and a semiconductor chip or a heat dissipation base using a lead-free welding operation, thereby preventing environmental contamination by suppressing a leakage of lead. CONSTITUTION: A semiconductor chip(4) is welded on an insulating substrate(2) while placing a solder layer(3) between the semiconductor chip and the insulating substrate. The solder layer welds the insulating substrate and the semiconductor chip. The insulating substrate comprises a ceramic substrate(2a) and conductive layers(2b,2c) arranged on both surfaces of the ceramic substrate. The insulating substrate is welded on a heat dissipation base(6) while placing the solder layer between the insulating substrate and the heat dissipation base. The solder layer(5) welds the insulating substrate and the heat dissipation base.