In a system for severing conductive links by laser irradiation to repair electronic devices, multiple laser beams are deflected at high-speed to target selected links for processing by positioning laser spots in a two dimensional pattern during relative motion of a substrate and a beam delivery system. As link targeting flexibility is increased, selection may be required from a large number of addressable link pairs. Various embodiments advantageously use beam deflection and beam splitting to improve memory repair processing rates.
申请公布号
WO2011156283(A3)
申请公布日期
2012.04.05
申请号
WO2011US39304
申请日期
2011.06.06
申请人
GSI GROUP CORPORATION;LAUER, WILLIAM;EHRMANN, JONATHAN, S.;GRIFFITHS, JOSEPH, J.
发明人
LAUER, WILLIAM;EHRMANN, JONATHAN, S.;GRIFFITHS, JOSEPH, J.