ELECTRONIC CIRCUIT MODULE AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a technique which can prevent swarf or material of a shield layer from unexpectedly adhering to a cut surface of a circuit board when cutting and separating the shield layer into pieces.

SOLUTION: A method for manufacturing an electronic circuit module comprises: an electronic component mounting step S100 for mounting an electronic component 12 on each circuit board 11 of an integrated substrate 20; a sealing resin layer forming step S200 for forming a sealing resin layer 13 which seals the electronic component 12; a first groove forming step S300 for cutting a part of the sealing resin layer 13 and the circuit board 11 to form a first groove 16; a shield layer forming step S400 for filling a conductive resin into the first groove 16 to form a shield layer 14; a second groove forming step S500 for cutting a part of the circuit board 11 to form a second groove 17; and a separating step S600 for separating the circuit boards 11 from each other into pieces by cutting the shield layer 14 by a cutting width smaller than the cutting widths of the first groove 16 and the second groove 17.

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