| 摘要 |
A process of forming an electronic device can include providing a first interconnect over a substrate having a primary surface, depositing a first insulating layer over the first interconnect, and patterning the first insulating layer to define an opening extending towards the first interconnect. The process can also include depositing a second insulating layer over the first insulating layer to seal the opening and form a cavity within the first opening, and forming a second interconnect over the first and second insulating layers. The cavity can be disposed between the first interconnect and the second interconnect. In another aspect, an electronic device can include a first interconnect, a first insulating layer defining a cavity, and a second interconnect. The cavity can be disposed between the first interconnect and the second interconnect, and a via may not be exposed within the cavity. |
