PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATOR FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY DEVICE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition that offers a highly-reliable cured film for a semiconductor device, which has high-sensitivity and high-resolution and is excellent in strength, ductility and heat resistance only with a resin and a photosensitive agent even when cured in a low temperature of about 200°C; a protective film; an insulator film; and a semiconductor device and a display device using the same.

SOLUTION: A photosensitive resin composition comprises: an alkali-soluble resin having a conjugate double bond structure at at least one terminal; an alkali-soluble resin having a dienophile structure at at least one terminal; and a photosensitive agent.

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