| 摘要 |
Disclosed is a method of manufacturing a piezoelectric vibrating piece. In a resist pattern forming step, a mask member is arranged in a wafer S while a mask-side mark formed in a mask member prepared for one electrode film is aligned with wafer-side marks S3 and S4 corresponding to the mask member. The mask-side mark has exposure openings which pass through the mask member, and the shape of each of the exposure openings in plan view differs between a plurality of mask members. A plurality of wafer-side marks S3 and S4 respectively have concave portions S5 and S6, and the shape of each of the concave portions S5 and S6 differs between a plurality of wafer-side marks S3 and S4 such that the wafer-side marks S3 and S4 have the same shape as the exposure openings in the corresponding mask member in plan view. In the resist pattern forming step, the concave portions S5 and S6 are exposed from the exposure openings to align the mask-side mark with the wafer-side marks S3 and S4.
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