| 摘要 |
1,245,332. Circuit boards. G. W. EDWARDS. 7 July, 1969 [12 July, 1968], No. 34194/69. Heading H1R. Holes are formed in the substrate for a printed circuit board in positions where terminal points are desired, conductive material then being bonded to one or both faces of the substrate, the circuit printed and etched, and the metal over the holes drawn down into the holes to form conductive walls therein. The circuit may be first laid out on squared paper, pins 7 then being inserted in holes 6 of a die plate 5 in positions corresponding to the terminal points 4. The plate is then used as a die to punch the necessary holes in a circuit substrate. Alternatively, if the unfilled holes are covered with a thin metal sheet, the plate may be used to mould a substrate. After the substrate has been covered with conductive material and the circuit formed, the die plate, fitted with smaller pins, is used to draw the metal covering the holes down into the holes. |
