发明名称 |
SOLID SHEET MATERIAL ESPECIALLY USEFUL FOR CIRCUIT BOARDS |
摘要 |
<p>A solid sheet which contains an nonwoven fabric made from short high tensile modulus fibers and a thermoplastic polymer having a low moisture absorption matrix resin that is useful as a substrate for circuit boards.</p> |
申请公布号 |
EP1420949(B1) |
申请公布日期 |
2012.04.04 |
申请号 |
EP20020763568 |
申请日期 |
2002.08.29 |
申请人 |
E.I. DU PONT DE NEMOURS AND COMPANY |
发明人 |
SAMUELS, MICHAEL, R.;KAHN, SUBHOTOSH;LEVIT, R. MIKHAIL |
分类号 |
B32B27/00;C08J5/04;B29B13/10;B32B15/04;B32B15/08;B32B27/12;H05K1/03 |
主分类号 |
B32B27/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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