发明名称 Integrated circuit package system with leadfinger
摘要 An integrated circuit package system includes: providing a lead terminal; forming a dummy lead near the lead terminal; positioning a base integrated circuit adjacent the lead terminal and the dummy lead; connecting a die connector to the base integrated circuit and the dummy lead; mounting a stackable integrated circuit over the base integrated circuit; and connecting another of the die connector to the stackable integrated circuit and the dummy lead.
申请公布号 US8148825(B2) 申请公布日期 2012.04.03
申请号 US20080134179 申请日期 2008.06.05
申请人 CAMACHO ZIGMUND RAMIREZ;TAY LIONEL CHIEN HUI;PISIGAN JAIRUS LEGASPI;PUNZALAN JEFFREY D.;STATS CHIPPAC LTD. 发明人 CAMACHO ZIGMUND RAMIREZ;TAY LIONEL CHIEN HUI;PISIGAN JAIRUS LEGASPI;PUNZALAN JEFFREY D.
分类号 H01L23/48;H01L21/00;H01L23/52;H01L29/40 主分类号 H01L23/48
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