| 摘要 |
PURPOSE: A package substrate, a module using the same, and an electric/electronic device are provided to prevent the degradation of electric reliability by suppressing an abnormal local heating. CONSTITUTION: A semiconductor chip(8) is mounted on one side of a package substrate(5). The semiconductor chip is connected to a terminal pattern unit of a ground pattern(3a-1) and a terminal pattern unit of a power source pattern(3a-2). The terminal pattern of the ground pattern and the terminal pattern unit of the power source pattern are engaged and alternatively arranged. A via is formed on an interlayer dielectric layer(4a-4e) as an interlayer dielectric conductor. A terminal pattern unit of the power source pattern is connected to the via through a bump array(7). |
