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发明名称
Apparatus for removing of solder ball on semiconductor package
摘要
申请公布号
KR101131445(B1)
申请公布日期
2012.03.29
申请号
KR20100048304
申请日期
2010.05.24
申请人
发明人
分类号
H01L21/60;H01L23/52
主分类号
H01L21/60
代理机构
代理人
主权项
地址
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