| 摘要 |
<P>PROBLEM TO BE SOLVED: To enable reduction in warpage of the wiring board after formation of a sealing body when the semiconductor device is manufactured. <P>SOLUTION: A wiring board 100 has product areas 102a and 102b, each of which consists of one or more product formation parts 101. In the wiring board 100, mold areas 109a and 109b that are set to the wiring board so as to include the product areas are sealed with a resin. The product areas are decentered so that the planar center positions of the product areas go off the planar center positions of the mold areas, and arranged and formed in the mold areas. <P>COPYRIGHT: (C)2012,JPO&INPIT |
