发明名称 LIGHT EMITTING DEVICE PACKAGE
摘要 A light emitting device package is disclosed. The disclosed light emitting device package includes a body comprising a cavity, and a recess formed at a bottom surface of the body, first and second lead frames mounted in the body, and a light source electrically connected with the first and second lead frames, wherein at least one of the first and second lead frames has a heat sink which is extended from a portion of the first or the second lead frames, and is disposed in the recess. The body includes a first coupler formed on at least a portion of the body. The heat sink includes a second coupler, to which the first coupler is coupled.
申请公布号 US2012074456(A1) 申请公布日期 2012.03.29
申请号 US201113304510 申请日期 2011.11.25
申请人 JIN HONGBOEM 发明人 JIN HONGBOEM
分类号 H01L33/62;H01L33/64 主分类号 H01L33/62
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