| 摘要 |
<p>An improved metal-to-substrate bond is attained by applying a resinous adhesive mixture to the surface of a nonconducting substrate, the mixture having finely divided particles dispersed therethrough. The particles are thereafter removed from the mixture to provide a microporous tortuous structure upon the substrates. Subsequently deposited metals are keyed into and upon the microporous structural layer to result in greatly improved peel strengths.</p> |
