| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve such problems that in a method for manufacturing a substrateless semiconductor package using a pressure-sensitive adhesive tape as a temporary fixing support, there are cases where a chip is not held due to pressure in resin sealing and is displaced from a specified position, or the package is broken due to curing of the sealing resin and strong pressure-sensitive adhesion to a chip surface and to a sealing material surface with heat in releasing a heat-resistant pressure-sensitive adhesive tape for manufacturing a semiconductor device. <P>SOLUTION: The heat-resistant pressure-sensitive adhesive tape for manufacturing the semiconductor device is a pressure-sensitive adhesive tape for temporarily fixing a chip, which is stuck to the chip and used in resin sealing the substrateless semiconductor chip, and has pressure-sensitive adhesive layers on both surfaces holding a substrate layer in between, wherein a silicone pressure-sensitive adhesive is contained in at least one of the pressure-sensitive adhesive layers on the side of resin sealing of the semiconductor chip. <P>COPYRIGHT: (C)2012,JPO&INPIT |
