| 摘要 |
An LED package structure includes a base, an LED chip, a frame, and a microstructure lens. The LED chip is arranged on the base. The microstructure lens is arranged on the LED chip, and is a first-order optical lens being subject to surface optical microstructure treatment. The frame is provided for securing the microstructure lens on the base. The microstructure lens of the LED package structure can concentrate the light emitted from the LED chip or vary light patterns of the light emitted from the LED chip so as to achieve the purpose of increasing brightness and luminous angles. |
