发明名称 |
STACKED SEMICONDUCTOR CHIP DEVICE WITH THERMAL MANAGEMENT |
摘要 |
A method of manufacturing is provided that includes placing a thermal management device in thermal contact with a first semiconductor chip of a semiconductor chip device. The semiconductor chip device includes a first substrate coupled to the first semiconductor chip. The first substrate has a first aperture. At least one of the first semiconductor chip and the thermal management device is at least partially positioned in the first aperture.
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申请公布号 |
US2012075807(A1) |
申请公布日期 |
2012.03.29 |
申请号 |
US20100889590 |
申请日期 |
2010.09.24 |
申请人 |
REFAI-AHMED GAMAL;BLACK BRYAN;SU MICHAEL Z. |
发明人 |
REFAI-AHMED GAMAL;BLACK BRYAN;SU MICHAEL Z. |
分类号 |
H01L23/34;H01L21/50 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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