发明名称 METHOD FOR TREATING MATERIAL TO BE TREATED AND TREATMENT APPARATUS USED FOR THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for treating a material to be treated capable of reducing the generation amount of a specified product or sub-product, to provide a treatment apparatus used for the same, to provide a method for treating the material to be treated capable of controlling the specified product to be generated, and to provide a treatment apparatus used for the same. <P>SOLUTION: In the method for treating the material to be treated, when the material to be treated including gas whose composition is changed by temperature change is in an activated state, the material to be treated is rapidly cooled to a temperature area or below where the material to be treated is changed into a specified component, and accordingly a treatment where the holding time of the temperature area allowing the specified component to be present is reduced and the composition of the material to be treated is changed is applied. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012061434(A) 申请公布日期 2012.03.29
申请号 JP20100208568 申请日期 2010.09.16
申请人 TOKYO INSTITUTE OF TECHNOLOGY 发明人 OKINO AKITOSHI;MIYAHARA SHUICHI;TAMURA TOSHIYUKI;KABURAGI YUKI
分类号 B01J19/08;B01D53/56;B01D53/74;B01J19/00;H05H1/30 主分类号 B01J19/08
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