| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a power module substrate with a heat sink, capable of promoting the diffusion of heat from a heating body such as an electronic component mounted on a first metallic plate, suppressing the generation of a crack on a ceramic substrate under the load of a thermal cycle, and having high reliability. <P>SOLUTION: A power module substrate 10 with a heat sink comprises a ceramic substrate 21, a first metallic plate 22 joined with one surface of the ceramic substrate 21, a second metallic plate 23 joined with the other surface of the ceramic substrate 21, and a heat sink 11 joined with the other surface side of the second metallic plate 23. The first metallic plate 22 is configured by copper or a copper alloy, and one surface of the first metallic plate 22 is made to be a mounting surface 22A on which an electronic component 3 is mounted. The second metallic plate 23 is configured by aluminum with proof stress not more than 30 N/mm<SP POS="POST">2</SP>. The heat sink 11 is configured by metallic material with proof stress not less than 100 N/mm<SP POS="POST">2</SP>, and the thickness of the heat sink 11 is made to be not less than 2 mm. <P>COPYRIGHT: (C)2012,JPO&INPIT |
