| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a storage package for a high heat radiation electronic component, which is inexpensive, prevents Ag migration, and is highly reliable. <P>SOLUTION: A storage package for high heat radiation electronic component 10 is formed by bonding an entire surface of one main surface of a ceramic frame body 13 including a window frame and a top surface of a heat sink plate 12 including a flat plate so as to interpose a bonding material layer 14 therebetween, and bonding a predetermined surface of the other main surface of the ceramic frame body 13 and lower surfaces of tip end portions of external connection lead terminals 15 including one or a plurality of flat plates so as to interpose a bonding material layer 14a therebetween. The bonding materials 14 and 14a are provided by printing Cu paste formed by mixing nonlead glass powder and a solvent into Cu metal powder on the heat sink plate 12 and/or the ceramic frame body 13 to form Cu-metallized films thereon, and then vertically laminating the heat sink plate 12, the ceramic frame body 13 and the external connection lead terminals 15, and then baking the Cu-metallized films. <P>COPYRIGHT: (C)2012,JPO&INPIT |
