Bonding process by molecular bonding with reduced overlay type misalignment

摘要

The method involves contacting wafers (100, 200) so as to initiate propagation of a bonding wave between the wafers. Predefined bonding curvature (KB) in shape of revolution parabolic is imposed to one of the wafers as a function of inherent curvature before bonding the wafer comprising a series of micro components (110) while the other wafer is free to conform to the predefined bonding curvature. The curvature of each wafer is measured before bonding, and the predefined bonding curvature is calculated. An independent claim is also included for an apparatus for bonding wafers by molecular adhesion, comprising a holding support.