Photocurable/Thermosetting Resin Composition, and Printed Circuit Board Using the Same,申请号KR20050015860-传众专利搜索

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发明名称	Photocurable/Thermosetting Resin Composition, and Printed Circuit Board Using the Same
摘要
申请公布号	KR101128571(B1)	申请公布日期	2012.03.27
申请号	KR20050015860	申请日期	2005.02.25
申请人		发明人
分类号	C08L31/06;G03F7/004;C08G59/62;C08K3/36;C08K5/00;C08L31/00;C08L63/00;C09D163/00;C09D201/08;G03F7/027;H05K1/00;H05K3/28;H05K3/46	主分类号	C08L31/06
代理机构		代理人
主权项
地址

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