HEAT-RADIATING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A heat radiation substrate and a manufacturing method thereof are provided to improve a heat radiation property by using an alumina layer and a copper substrate instead of an epoxy resin layer and an aluminum substrate. CONSTITUTION: An alumina layer(320) is formed on one side of a copper substrate(330). A first circuit layer(340) is formed on the alumina layer and includes a first circuit pattern(340a) and a first pad unit(340b). A second circuit pattern(350a) corresponds to the first circuit pattern. A second pad unit(350b) corresponds to the first pad unit. A heating element is mounted on the first pad unit and the second pad unit. An opening passes through the alumina layer.