METHOD FOR FORMING VIA HOLE IN PRINTED CIRCUIT BOARD

摘要

PURPOSE: A via hole formation method of a printed circuit substrate is provided to easily arrange a plating layer within a via-hole by combining a conductive post and a base substrate in which the via-hole is formed. CONSTITUTION: A via hole is formed by punching a base substrate(S100). A conductive post is arranged on a carrier(S110). The base substrate in which the via hole is formed is combined with the carrier in which the conductive post is arranged(S120). The inside of the via hole is filled with plug(S130). The carrier is eliminated(S140). The upper surface and the lower surface of the base substrate is buffed and polished(S150). A desmear process and a plating process are performed on the upper surface and lower surface of the base substrate(S160). A circuit is formed on the plated base substrate(S170).