PURPOSE: An ink jet head assembly is provided to improve a processing yield rate because the number of ink jet heads produced from one wafer is increase by decreasing a whole width of the ink jet head. CONSTITUTION: An ink jet head assembly(100) comprises a ink jet head plate(110), a piezoelectric actuator(120), a package unit(130), an electrical connection unit(154). A flow path for ink is formed in the ink jet head plate. The piezoelectric actuator supplies a driving force for ejecting ink from the pressure chamber to the nozzle. An ink transferring unit(152) of the package unit transfers the ink to an inlet(111) of the ink jet head plate. The electrical connection unit is electrically connected to the piezoelectric actuator. The ink transferring unit is horizontally extended toward one direction of the package unit.
申请公布号
KR20120028964(A)
申请公布日期
2012.03.23
申请号
KR20120024441
申请日期
2012.03.09
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
KANG PIL JOONG;PARK, CHANG SUNG;JOUNG, JAE WOO;YANG, CHUNG MO