COMPLEX SEMICONDUCTOR DEVICE FOR USE IN MOBILE EQUIPMENT

摘要

PURPOSE: A complex semiconductor device is provided to efficiently perform control or test task of various memory chips within a package through one controller. CONSTITUTION: A first chip package(100) accepts multi-chips. A second chip package(220) accepts memory chips for a mass storage. A controller(210) includes a complex package with the first and second packages and controls chips within the first and second packages. The complex package includes a package-on-package. The controller is connected to the outside of the complex package.