| 摘要 |
A method for depositing thin films on thin elongated, electrically insulating substrates by bias-sputtering material from two targets on to the substrates in an electrical plasma, the substrates being suspended over apertures in an electrically biased metallic substrate holder, around which is formed a dark space filling said apertures and surrounding the substrates. A thin film deposited by said method has good film adhesion, good all-over uniformity and electrical properties close to the bulk valus of the film material so as to be applicable as sensing element in sensors.
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