POLISHING PAD FOR CMP

摘要

The present invention relates to a polishing pad for CMP. The polishing pad has a shape in which three or more semi-oval or semicircular curves connecting two adjacent valleys on a plane are connected to each other. Also, the polishing pad includes a modified pattern having a predetermined depth. In the polishing pad, slurry may be uniformly dispersed during a polishing process to improve polishing uniformity and increase a polishing rate by adequately adjusting a residence time of the slurry.