METHOD FOR ELECTROPLATING LONG CONDUCTIVE SUBSTRATE, METHOD FOR MANUFACTURING COPPER-COATED LONG CONDUCTIVE SUBSTRATE USING THE METHOD AND ROLL-TO-ROLL TYPE ELECTROPLATING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a copper-coated long conductive substrate, whereby surface accuracy of a copper plating layer on the copper-coated long conductive substrate can be improved.

SOLUTION: The method for electroplating a long conductive substrate comprises: sending the long conductive substrate so that it is kept substantially horizontal in its width direction; and depositing a metal plating film layer on a surface of a seed layer by a wet plating method by an electroplating method using a plurality of insoluble anodes. The plurality of insoluble anodes are electrically divided into at least two portions in a sending direction. Among the divided insoluble anodes, those depositing an electroplating film with a total film thickness of ≤2 μm has a current density controlled to ≤2 mA/cm2.

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