| 摘要 |
PURPOSE: A conductive epoxy resin composition for LED die bonding and a manufacturing method thereof are provided to enhance die shear strength and heat resistance. CONSTITUTION: A conductive epoxy resin composition for LED die bonding comprises plate-like silver, trisphenol methane triglycidyl ether(TMTG) which is represented by chemical formula 1 or a compound including derivative thereof, cycloaliphatic epoxide which is represented by following chemical formula 2 or a compound including derivative thereof, epoxy compound which is represented by chemical formula 3, and hardener selected from imidazole based, amide based, and polyamide based tetrabutyl ammonium hexafluoroantimonate, and ammonium hexafluoroantimonate. |
