| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a small, thin, and high heat dissipation type resin sealing type semiconductor device corresponding to cost reduction, by enhancing reliability of wire bonding connection of a resin package and a mounting substrate connection, and a method of manufacturing the same. <P>SOLUTION: In this resin sealing type semiconductor device in which the bottom faces of a die pad and an external connection lead are exposed from the bottom face of a sealing body, the first surface of a semiconductor element to which one end of a bonding wire is connected, a second surface on the top face of an inner lead on the inside of the external connection lead to which the other end is connected, and a third surface which is the almost center of the thickness direction of the sealing body are almost flush with each other, a vertically formed bent portion is formed in the external connection lead, and the whole surface of the external connection lead which is exposed from the sealing body has a plated layer. <P>COPYRIGHT: (C)2012,JPO&INPIT |
