ELECTRONIC APPARATUS AND ELECTRONIC MODULE

摘要

PROBLEM TO BE SOLVED: To sufficiently block noise and effectively use a space when arranging an LSI three-dimensionally.

SOLUTION: A semiconductor device 103 is incorporated in a wiring board 100. The wiring board 100 comprises: multiple first conductors 106 provided at an area overlapping with the semiconductor device 103 in a plan view so as to be spaced apart from each other; a via 120 connecting at least one of the multiple first conductors 106 with the semiconductor device 103; a second conductor 102 provided at the side opposite to the multiple first conductors 106 with the semiconductor device 103 interposed therebetween and covering the multiple first conductors 106 in a plan view; a third conductor 101 provided at the side opposite to the semiconductor device 103 with the multiple first conductors 106 interposed therebetween and covering the multiple first conductors 106 in a plan view; and a structure which is provided at a space sandwiched by the second conductor 102 and the third conductor 101 so as to enclose the semiconductor device 103 and has a repeated structure.

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