| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a peeling device capable of coping with miniaturization of a semiconductor device. <P>SOLUTION: A peeling device 7 for a semiconductor chip has an upthrust member having an upthrust surface arranged opposite to a dicing sheet, and upthrust member moving means that moves the upthrust member vertically. The upthrust member has an outer peripheral upthrust member 71 having an outer peripheral upthrust surface 71d arranged opposite to a plan-view outer peripheral part of a bonding surface of a semiconductor chip with the dicing sheet, and a center upthrust member 72 having a center upthrust surface arranged opposite to a plan-view center part of the bonding surface. The upthrust member moving means has outer peripheral upthrust member moving means that moves only the outer peripheral upthrust member 71 vertically and independently, and center upthrust surface moving means that thrusts up only the center upthrust member 72 independently. <P>COPYRIGHT: (C)2012,JPO&INPIT |
