| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an LED package manufacturing system that can improve production yield by having uniform light emission characteristics of LED packages even if there are variations in emission wavelengths of individual LED elements. <P>SOLUTION: Element characteristics information 12, which is obtained by individually measuring light emission characteristics of a plurality of LED elements in advance, and resin coating information 14, in which the element characteristics information 12 is associated with an appropriate coating amount of resin for obtaining LED packages having prescribed light emission characteristics, are prepared in advance. Map data 18, in which the element characteristics information 12 is associated with mounting location information 71a that indicates a location on a substrate of the LED elements mounted by a component mounting device M1, is created for each substrate by a map creation processing unit 74. The resin coating information 14 is updated on the basis of inspection results which are generated by inspecting finished products coated with the resin using a light emission characteristics inspection device M7, and are fed back to a resin coating apparatus M4. <P>COPYRIGHT: (C)2012,JPO&INPIT |
