| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component device, capable of easily performing over-mold and under-fill without requiring a jig for preventing a molten resin composition from leaking out, and a electronic component sealing composition sheet for the same. <P>SOLUTION: In conformity with an electronic component mounting area on a mounting substrate, a sheet B having an area a little smaller or slightly larger than the mounting area and viscosity of 20-250 Pa s at a molding temperature is mounted, and after a sheet A having an area larger than the mounting area and viscosity of 2,000-50,000 Pa s at the molding temperature is mounted on top of the sheet B, it is heated to the molding temperature in a de-compressed chamber to make them hang down until the electronic component and the sheet B are coated with the sheet A. After that, a pressure in the chamber is released to perform under-fill of the electronic component by the molten material of the sheet B in a sealed space formed by coating of the sheet A between the mounting substrate and itself. <P>COPYRIGHT: (C)2012,JPO&INPIT |
