发明名称 THERMAL HEAD
摘要 <P>PROBLEM TO BE SOLVED: To provide a thermal head suppressing electrostatic charging of a sealing member and the like, and promoting size and weight reduction of the thermal head to facilitate high-speed operation. <P>SOLUTION: A support substrate 13 and a drive circuit board 19 are affixed onto a heat radiation substrate 11. A heating element constituted of a heating part 17 of a heating resistor 15 formed via a glaze layer 14 and a pair of electrodes 16a, 16b for energizing the heating part 17 is disposed on a surface of the support substrate 13 and is covered with a protective layer 18. A drive IC 20 for driving the heating element is formed on the drive circuit board 19 and is electrically connected to it via a bonding wire W. Here, a sealing member 21 for resin-sealing a connection part of the bonding wire W or the like and the drive IC 20 is constituted of a first sealing part 21a and a second sealing part 21b on the first sealing part. The first sealing part 21a is made of epoxy resin, and the second sealing part 21b is made of silicone resin. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012056231(A) 申请公布日期 2012.03.22
申请号 JP20100202932 申请日期 2010.09.10
申请人 TOSHIBA HOKUTO ELECTRONICS CORP 发明人 SUGAWARA KAKU
分类号 B41J2/345;B41J2/335 主分类号 B41J2/345
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