发明名称 |
FILM-FORMING APPARATUS AND FILM-FORMING METHOD |
摘要 |
A film-forming apparatus and film-forming method is provided that includes a reflector system capable of adjusting the temperature distribution of a substrate. The essential role of a reflector is to reduce the output of a heater by reflecting radiation heat from the heater and to protect members provided below the heater from heat. When a silicon wafer is heated by a first heater and a second heater, the temperature of the silicon wafer becomes higher in the inner circumferential part of the wafer rather than in the outer circumferential part of the silicon wafer. When a ring-shaped reflector is used, radiation heat is reflected by the ring-shaped portion, but is not reflected by the inner circumferential part of the reflector. Therefore, the use of a ring-shaped reflector makes it possible to allow a wafer to have an even heating distribution. |
申请公布号 |
US2012070577(A1) |
申请公布日期 |
2012.03.22 |
申请号 |
US201113231265 |
申请日期 |
2011.09.13 |
申请人 |
DEURA KAORI;HIGASHI SHINYA;SUZUKI KUNIHIKO;ITO HIDEKI |
发明人 |
DEURA KAORI;HIGASHI SHINYA;SUZUKI KUNIHIKO;ITO HIDEKI |
分类号 |
C23C16/46;B05C9/14;B05C13/00 |
主分类号 |
C23C16/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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