| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor laser device and an optical device that have high reliability in a low cost. <P>SOLUTION: A semiconductor laser device 100 comprises a package 30 including a base 10 and a sealing member 20 that seal a blue-violet semiconductor laser element 40. Through holes 11c and 11d are formed in a stem 11 of the base 10, and lead terminals 14 and 15 are penetrated therethrough. The lead terminals 14 and 15 are bonded to the base 10 with electrically insulated to the base 10 by adhesives 50 and 51 composed of an epoxy resin filled in the through holes 11c and 11d. At the front of the through holes 11c and 11d, silicon resins 60 and 61 are filled so as not to expose the adhesives 50 and 51 beyond the through holes. Additionally, coating agents 70 and 71 composed of an EVOH resin are formed at the openings of the through holes 11c and 11d on the side of a front surface 11a of the stem 11 so as not to expose the silicon resins 60 and 61. <P>COPYRIGHT: (C)2012,JPO&INPIT |
