| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing apparatus that can accurately determine the end of a life of a polishing pad and reduce the exchange frequency of the polishing pad. <P>SOLUTION: The polishing apparatus includes: a table rotating motor 70 configured to rotate a polishing table 12; a top ring rotating motor 71 configured to rotate a top ring 20; a dresser 50 configured to dress the polishing pad 22; a pad-height measuring instrument 60 configured to measure a height of the polishing pad 22; and a diagnostic part 47 configured to calculate an amount of wear of the polishing pad 22 from the height of the polishing pad 22 and to determine the end of a life of the polishing pad 22 based on the amount of the wear of the polishing pad 22, the torque or current of the table rotating motor 70, and the torque or current of the top ring rotating motor 71. <P>COPYRIGHT: (C)2012,JPO&INPIT |
