IMAGING DEVICE, IMAGING MODULE AND METHOD FOR MANUFACTURING IMAGING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an imaging device, an imaging module and a method for manufacturing an imaging device having improved productivity.

SOLUTION: An imaging device includes: a substrate; a photodetecting portion; a circuit portion; and a through interconnect. The substrate has a recess portion and a through hole. The recess portion is provided on a fist major surface of the substrate. The recess portion is designed to be set back toward a second major surface opposite to the first major surface. The through hole passes through the first major surface and the second major surface, and extends in a first direction from the first major surface to the second major surface. The photodetecting portion is provided above the recess portion so that it is separated from the substrate. The circuit portion communicate with the photodetecting portion and is provided on the first major surface. The through interconnect is provided inside the through hole and communicates with the circuit portion. The recess portion has a first inclined surface which is inclined to the first major surface. The through hole has a second inclined surface parallel to the first inclined surface.

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