RESIN COMPOSITION, ADHESIVE FILM, SEMICONDUCTOR DEVICE, MULTILAYER CIRCUIT BOARD AND ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a resin composition which can align easily a first adherend and a second adherend, when bonding the first adherend to the second adherend, and to provide an adhesive film using such a resin composition, a semiconductor device, a multilayer circuit board and an electronic component.

SOLUTION: This resin composition is used when bonding the first adherend to the second adherend, so as to constitute a resin composition layer 1 provided on the first adherend. The resin composition is constituted so that the resin composition layer 1 is provided with an average thickness t [μm], and that, assuming that an absorption coefficient of the resin composition layer 1 in light of the wavelength of 800 nm is α [1/μm], following formula (1): α×t≤-log10(0.05), and formula (2): 1≤t≤200 are satisfied.

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