发明名称 CAPACITOR, MANUFACTURING METHOD THEREFOR, CIRCUIT BOARD AND SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To form a capacitor which can be built in a build-up substrate using an aerosol deposition method. <P>SOLUTION: A manufacturing method includes: a process of forming a first ceramic film on a first substrate composed of a metal; a process of forming a second ceramic film on a second substrate composed of a metal; a process of forming a first electrode pattern composed of copper and a first via plug pattern on one surface of the first and second ceramic film away from each other; a process of joining the first and second ceramic films with each other through the first electrode pattern and the first via plug pattern by applying a pulse voltage between the first substrate and the second substrate in the state that the first substrate and the second substrate are pressurized for the first ceramic film and the second ceramic film by pressurizing the first substrate and the second substrate with each other; and a process of removing the second substrate. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012060034(A) 申请公布日期 2012.03.22
申请号 JP20100203637 申请日期 2010.09.10
申请人 FUJITSU LTD 发明人 IMANAKA YOSHIHIKO;AMADA HIDEYUKI;KUMASAKA FUMIAKI
分类号 H01G4/30;H01G4/12;H01L21/60;H05K3/46 主分类号 H01G4/30
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