发明名称 CURABLE COMPOSITION
摘要 <p>The present invention addresses the problem of providing a fast-curing curable composition able to be used as a sealing material or an adhesive material, etc., and which can provide a cured product that is flexible and tough. The problem is solved by using a curable composition characterized by containing: an organic polymer (A) with a reactive silicon group indicated by general formula SiR1 aR2 bXc (wherein: R1 is a C1-20 hydrocarbon group wherein at least one hydrogen atom on carbon atoms at position 1 to position 3 has been replaced by -OR3; R2 indicates a C1-20 hydrocarbon group, a C6-20 aryl group, a C7-20 aralkyl group, or a triorganosiloxy group indicated by R0 3SiO-; and X indicates a hydroxyl group or a hydrolysable group) at the molecular chain end; and a silane coupling agent (B) with a hydrolysable silicon group and an amino group in each molecule.</p>
申请公布号 WO2012036109(A1) 申请公布日期 2012.03.22
申请号 WO2011JP70694 申请日期 2011.09.12
申请人 KANEKA CORPORATION;MIYAFUJI, KIYOSHI;HARUMASHI, TATSURO;WAKABAYASHI, KATSUYU 发明人 MIYAFUJI, KIYOSHI;HARUMASHI, TATSURO;WAKABAYASHI, KATSUYU
分类号 C08L101/10;C08G65/336;C08K5/5419;C09J201/10;C09K3/10 主分类号 C08L101/10
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