发明名称 |
POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD OF CREATING RESIST PATTERN, AND ELECTRONIC COMPONENT |
摘要 |
<p>The disclosed positive photosensitive resin composition contains an alkali-soluble resin having a phenolic hydroxyl group, a compound that generates acids by light, a thermal cross-linking agent, and a silane compound having at least one functional group selected from an epoxy group and a sulfide group.</p> |
申请公布号 |
WO2012036000(A1) |
申请公布日期 |
2012.03.22 |
申请号 |
WO2011JP70055 |
申请日期 |
2011.09.02 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD.;TANIMOTO AKITOSHI;NOBE SHIGERU;KASUYA KEI;MATSUTANI HIROSHI;UENO TAKUMI;AOKI YU;TAHARA SHINGO |
发明人 |
TANIMOTO AKITOSHI;NOBE SHIGERU;KASUYA KEI;MATSUTANI HIROSHI;UENO TAKUMI;AOKI YU;TAHARA SHINGO |
分类号 |
G03F7/075;G03F7/004;G03F7/023;H01L21/027 |
主分类号 |
G03F7/075 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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