| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve solder solution resistance and acid resistance against high melting point solder. <P>SOLUTION: A conductive paste according to the present invention includes: (A) conductive powder; (B) a glass frit containing 85 wt.% or more in total of a constituent comprising the following composition in terms of oxides, and which is substantially lead free; (C) 0.1-20 pts.wt. of at least one metal oxide selected from the group consisting of titanium oxide and zinc oxide relative to 100 pts.wt. of the conductive powder; and (D) an organic vehicle. Proportions in the glass frit are: SiO<SB POS="POST">2</SB>...15-55 wt.%; Al<SB POS="POST">2</SB>O<SB POS="POST">3</SB>...22-52 wt.%; MgO...2-25 wt.%; and B<SB POS="POST">2</SB>O<SB POS="POST">3</SB>...5-45 wt.%. <P>COPYRIGHT: (C)2012,JPO&INPIT |
