SOLDERING TIP, HAVING A SURFACE WITH A GRID STRUCTURE

摘要

A soldering tip for a soldering device which comprises a heat generating or heat conducting base body, and which on the outside thereof has a contact surface that can be wetted by solder at least in sections. The material of the contact surface has a lattice structure. Charged elementary particles of at least one foreign material are incorporated into the lattice structure of the contact surface.