发明名称 Structures and methods of forming SiGe and SiGeC buried layer for SOI/SiGe technology
摘要 Semiconductor structures and methods of forming semiconductor structures, and more particularly to structures and methods of forming SiGe and/or SiGeC buried layers for SOI/SiGe devices. An integrated structure includes discontinuous, buried layers having alternating Si and SiGe or SiGeC regions. The structure further includes isolation structures at an interface between the Si and SiGe or SiGeC regions to reduce defects between the alternating regions. Devices are associated with the Si and SiGe or SiGeC regions. The invention is also directed to a design structure on which a circuit resides.
申请公布号 US8138579(B2) 申请公布日期 2012.03.20
申请号 US20070867995 申请日期 2007.10.05
申请人 LIU XUEFENG;RASSEL ROBERT M.;VOLDMAN STEVEN H.;INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 LIU XUEFENG;RASSEL ROBERT M.;VOLDMAN STEVEN H.
分类号 H01L23/58 主分类号 H01L23/58
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