APPARATUS FOR SINGULATION PROCESSING OF SEMICONDUCTOR PACKAGE

摘要

PURPOSE: An apparatus for singulation processing of a semiconductor package is provided to minimize the increase of a total process time by enabling a semiconductor package to be overturned 180 degrees and to be received. CONSTITUTION: A dry block(40) horizontally moves along a guide rail(42). A flipper(50) is installed in a rectangular flipper frame(51) and is rotatable around the horizontal shaft(52) of the rectangular flipper frame. A second unit picker(100) horizontally moves to an arbitrary location along an X-axis guide frame(102). A top side inspection camera(110) is installed in one side of the second unit picker. A vision camera for inspecting the top side is combined with a Y-shaft driver and a Z-shaft driver.